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Custom Medical Electronics PCB Manufacturing 2 Layer Green Solder Mask ENIG PCB

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Custom Medical Electronics PCB Manufacturing 2 Layer Green Solder Mask ENIG PCB

Name: Custom Medical Electronics PCB Manufacturing 2 Layer Green Solder Mask ENIG PCB
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR-4 TG150

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.0mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 2-Layer

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Custom Medical Electronics PCB Manufacturing / 2 Layer Green Solder Mask ENIG PCB

Medical Grade 2 Layer Through-Hole PCB with ENIG Finish and Green Solder Mask is specifically designed for medical electronic devices requiring exceptional reliability, biocompatibility, cleanliness, and full production traceability. As a critical foundation for medical equipment, this PCB is manufactured under stringent process controls to ensure superior hole-wall integrity, stable electrical performance, and long-term operational reliability.

Key Specifications

Layer Count	2-Layer
Material	FR-4 TG150
Board Thickness	1.0 mm (Customizable)
Copper Thickness	1/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

Medical Grade PCB Manufacturing

Designed specifically for medical electronic devices.
Manufactured under strict quality and reliability standards.
Fully compliant with ISO 13485 traceability requirements.

Precision Through-Hole Drilling Technology

Burr height controlled within ≤10μm.
Entry board and backup board drilling process.
No hanging copper debris or smear at hole entrances.

Superior Hole Wall Quality

Hole wall roughness maintained at ≤22μm.
Optimized for uniform copper deposition.
Improves long-term plated through-hole reliability.

Advanced Desmear Verification

Backlight inspection Grade ≥9.
Complete removal of resin residues.
Ensures high-quality metallization.

High Reliability Copper Plating

Average through-hole copper thickness ≥18μm.
Copper thickness variation ≤4μm.
Excellent electrical conductivity and mechanical strength.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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