Via Filled PCB Via In Pad PCB 0.6mm Multilayer PCB Assembly 6 Layer For GPS Tracking

This 6-layer multilayer PCB adopts advanced via filled and via-in-pad technology together with blind via structure, with finished board thickness of 0.6mm, specially designed for GPS tracking devices.
Via filling and via-in-pad design eliminates solder wicking during SMT assembly, improves soldering integrity for BGA and compact chips, saves valuable PCB surface space for high-density component layout. Blind vias realize interconnection between adjacent layers without penetrating the whole board, effectively shortening signal paths, reducing signal interference and enhancing positioning signal stability for GPS modules.
The slim 0.6mm overall thickness meets the lightweight and miniaturization requirements of portable GPS trackers. We support customized impedance tuning for GPS RF circuits and offer multiple surface finishes including ENIG, OSP and Immersion Silver. All products are produced in accordance with IPC standards and comply with RoHS regulations. Widely used in vehicle GPS trackers, asset location trackers, personal GPS positioning devices and wearable tracking modules. Prototype samples and mass production orders are available.