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24 Layer FR4 High Frequency PCB Board 2.5mm With Immersion Gold Surface

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24 Layer FR4 High Frequency PCB Board 2.5mm With Immersion Gold Surface

Name: 24 Layer FR4 High Frequency PCB Board 25mm With Immersion Gold Surface
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : Fr4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : Lead-free Soldering

Payment Terms : Western Union

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1 oz

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 2.5 mm (Customizable)

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 24-Layer

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24 Layer FR4 High Frequency PCB Board 2.5mm Immersion Gold Surface For Mobile

This 24-layer FR4 high frequency PCB with 2.5mm overall thickness and immersion gold surface finish is specially designed for mobile communication equipment. It adopts high-Tg low-loss FR4 dielectric material to balance excellent high-frequency signal performance and cost advantage. Rigorous multilayer lamination process ensures stable layer alignment and reliable interlayer conduction. Immersion gold surface delivers flat soldering pads, good oxidation resistance and outstanding bonding performance for IC, RF components and BGA chips. Strict controlled impedance is implemented to maintain signal integrity during high-speed data and RF transmission. Widely used in mobile terminal communication mainboards, communication modules, handheld wireless devices and related mobile electronics.

Key Specifications

Layer Count	24-Layer
Material	Fr4
Board Thickness	2.5 mm (Customizable)
Copper Thickness	1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	Lead-free Soldering

Product Description

1.24-layer multilayer structure, finished board thickness: 2.5mm, stable mechanical structure
2.High frequency low loss FR4 substrate, suitable for mobile communication high-speed signal transmission
3.Precise layer alignment & advanced lamination technology, minimal interlayer displacement
4.Professional controlled impedance capability, effectively reduce high-frequency signal crosstalk and attenuation
5.Good thermal resistance and high Tg property, withstand multiple SMT reflow processes
6.Stable dimensional stability, less warpage after processing
7.Excellent electrical insulation performance, consistent batch production quality
8.Suitable for assembling BGA, QFN and various miniature communication chips

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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