Home > High Frequency Printed Circuit Board >

High Frequency Density 10 Layer HDI PCB Design For 5G Communication Equipment

Product Categories

Single Layer Printed Circuit Board [10]
Double Layer Printed Circuit Board [10]
Multilayer Printed Circuit Board [17]
HDI Printed Circuit Board [10]
High Frequency Printed Circuit Board [12]
Server PCB [8]
Communication PCB [14]
Industrial Control PCB [10]
Copper Substrate PCB [2]
Medical Circuit Board [6]
Automotive Printed Circuit Board [6]
Drone PCB Board [5]
5G Optical Module PCB [5]
Radio Frequency PCB [5]

Shenzhen Xunsiwei Circuit Co., Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

High Frequency Density 10 Layer HDI PCB Design For 5G Communication Equipment

Name: High Frequency Density 10 Layer HDI PCB Design For 5G Communication Equipment
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : Fr4 Tg170

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : Lead-free soldering

Payment Terms : Western Union

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1/1/1/1/1 oz

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.5 mm (Customizable)

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 10-Layer

Contact Now

HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment

This 10-layer HDI PCB with ENIG surface finish is engineered for high-density and high-frequency circuits of 5G communication equipment. Adopting advanced HDI microvia technology, the board realizes fine circuit routing, compact component layout and effective miniaturization of communication modules. High-frequency optimized substrate guarantees superior signal integrity for RF and high-speed digital signals under 5G frequency bands. ENIG (Electroless Nickel Immersion Gold) treatment provides flat pad surface, excellent oxidation resistance and reliable soldering performance for BGA, QFN and mini semiconductor devices. Precise impedance control, stable layer alignment and low signal loss make this HDI multilayer board widely applied in 5G communication terminals, RF transceivers, communication gateway modules and wireless signal processing units.

Key Specifications

Layer Count	10-Layer
Material	Fr4 Tg170
Board Thickness	1.5 mm (Customizable)
Copper Thickness	1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	Lead-free soldering

Product Description

1.10-layer HDI multilayer structure with microvia technology, support fine line & high-density wiring
2.High-frequency material option available, effectively reduce RF signal attenuation for 5G application
3.Optimized for high-density component arrangement, help realize equipment lightweight and miniaturization
4.Accurate layer registration and reliable interlayer connection via blind & buried vias
5.Strict controlled impedance tolerance, maintain stable transmission of high-speed & RF signals
6.Outstanding solderability, perfectly compatible with fine-pitch BGA, microchip and SMT assembly
7.Low dielectric loss, less signal crosstalk in high-frequency working environment
8.Good thermal stability, withstand multiple SMT reflow soldering processes
9.Compliant with IPC manufacturing standards, stable performance for commercial 5G communication devices

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

Product Tags: